Hale Hana Kaapuni Kaapuni Paa Paa
CDADAhe mea hana 'oihana a me ka mea hoolako o Molded Case Circuit Breakers. ʻO kēia pūʻulu huahana kekahi o kā mākou makana nui, i kākoʻo ʻia e 40 mau makahiki o ka ʻike e pili ana i ko mākou hoʻomaka ʻana. Me ka laulā o nā hiʻohiʻona e pili ana i nā kūlana he nui, hiki i nā mea kūʻai honua ke koho i kā mākou huahana me ka hilinaʻi piha.
He aha ka mea hoʻoheheʻe kaapuni i hoʻoheheʻe ʻia?
A Hoʻoheheʻe Kaapuni Kaapuni (MCCB)he mea paʻa, hoʻopaʻa haʻahaʻa-voltage i hoʻopaʻa ʻia no ka mālama ʻana i nā ʻōnaehana hoʻoili uila mai ka hoʻouka ʻana, nā pōkole pōkole, a me nā hemahema o ka honua. Hoʻopili ʻia i loko o ahale palaki thermosetting, Hana nā MCCB i nā voltage helu a hiki i690V AC (50/60Hz)me nā helu o kēia manawa mai10A a 2000A, lawelawe ʻana ma ke ʻano he mea pale hana hana ma waena o nā noi ʻoihana, ʻoihana, a me nā ʻōnaehana.
Aia ka ʻano wehewehe o nā MCCB i kā lākouhana hoʻoheheʻe ʻia—he paʻi plastik thermosetting ikaika kiʻekiʻe e hāʻawi ana i ka insulation Class II (insulation pālua) ma waena o nā mea i loko ola a me ka interface hana waho. Mālama kēia hoʻolālā i ka palekana o ka mea hoʻohana me ka mālama ʻana i nā ana paʻa a me nā kaha haki kiʻekiʻe a hiki i100kA ma 380/415V.
ʻAʻole likeNā mea ʻoki kaapuni ea (ACB), hiʻona MCCBsnā hoʻolālā paʻa, hiki ʻole ke mālama ʻia(i ka hapanui o na hihia) me na hana kuloko i sila, e haawi ana i ka palekana no na kaapuni kaapuni lua kahi e pono ole ai ka malama mau.
Nā Māhele Huahana a me nā Hoʻonohonoho
| Hoʻokaʻawale | ʻAno | Lahui o keia manawa | Nā ʻano nui |
| ʻenehana Hui huakaʻi | Thermal-Magnetic | 10A – 800A | Bimetallic overload + magnetic short-circuit, hoʻonohonoho paʻa/hoʻololi, hoʻokele waiwai |
| LSIG uila | 100A – 2000A | Microprocessor-based, adjustable curves, hiki ke kamaʻilio, pale pololei | |
| Kaʻina hoʻokomo | Paʻa | 10A – 2000A | ʻO ka pilina busbar pololei, hoʻokomo mau, ke kumu kūʻai haʻahaʻa |
| Pākuʻi | 100A – 1600A | ʻO ke kino i kau ʻia ma lalo, hiki ke hoʻihoʻi ʻia no ka mālama ʻana, hoʻemi ʻia ka manawa haʻahaʻa | |
| Hiki ke unuhi | 250A – 2000A | Mekani huki, hiki ke hoʻokaʻawale piha, nā pani pale | |
| Hoʻo·pololei | 2-Pole | 10A – 800A | Nā ʻōnaehana hoʻokahi, nā noi DC |
| 3-Pole | 10A – 2000A | Nā noi ʻoihana ʻekolu-phase maʻamau | |
| 4-Pole | 16A – 2000A | ʻEkolu mau ʻāpana me ka pale kūʻokoʻa, nā hoʻonohonoho kūʻokoʻa hiki ke hoʻololi ʻia (50-100%) | |
| Kaha Haʻihaʻi | Kūlana (S1) | 16kA – 50kA | Hoʻolaha maʻamau, nā pūnaewele pae haʻahaʻa |
| Kiʻekiʻe (H1) | 65kA – 85kA | ʻOihana nui, nā kikowaena hoʻokele kaʻa | |
| Kiʻekiʻe-Kiʻekiʻe (H2/H3) | 100kA – 200kA | ʻO ka hana mana, ʻoihana kaumaha, ʻoihana | |
| Māhele koho | Māhele A | ≤400A | ʻAʻohe manaʻo hoʻopaneʻe manawa pōkole, huakaʻi koke |
| Māhele B | ≥400A | Hoʻopaʻa manawa pōkole (Icw), koho koho me ka lohi |
ʻO ka nui o ke kiʻi:
Pākuʻi Paʻi: 10A – 160A (Panelboard kau ana, DIN rail kūpono)
Pākuʻi Kauwaena: 160A – 630A (Ka pale kaʻa, nā papa hoʻolaha)
Papa Nui: 630A – 1600A (Ka mahele nui, nā ʻōnaehana busbar)
Pāʻani Maxi: 1600A – 2000A (Infrastructure, hana mana)
Nā hana kumu a me nā hiki ke pale
Nā Hana Palekana
| Hana | Mechanism | Nā ʻāpana ʻenehana |
| Palekana ʻOi aku (L) | Hoʻonui wela bimetallic strip | 0.7 – 1.0 × I ka hoʻonohonoho ʻana, ka pihi manawa hoʻololi, 40°C reference ambient |
| Kaapuni Pokole koke (I) | Plunger solenoid electromagnetic | Paʻa: 5-10 × I loko, Hiki ke hoʻololi ʻia: 2-15 × I loko, <20ms hana |
| Hoʻopaneʻe Kaapuni Pōkole (S) | Kaapuni manawa uila | 0.1s - 0.5s lohi, 2-10 × Ma ka hoʻonohonoho, koho koho |
| ʻAha ʻĀina (G) | Vector sum i kēia manawa | 20-100% o In, 0.1s-1.0s lohi, kumu-kaulike a i ʻole ke ʻano koena. |
| Ka palena o kēia manawa | High-speed repulsion contact system | <10ms manawa wehe (≤630A), <15ms (≤1600A), ho'ēmi ikehu hoʻokuʻu |
| Hoʻokuʻu Undervoltage | Puka uila ʻike | 35-70% Un tripping, 0.1s-3s hiki ke lohi |
ʻO nā hiʻohiʻona holoʻokoʻa Electronic Trip Unit
Hāʻawi nā mea hoʻopuka microprocessor hou:
ʻIke RMS maoli: Ke ana pololei o nā ʻano nalu ʻino
ʻO ka hoʻopaʻa ʻana i nā ʻāpana koho (ZSI): Ka hoʻohui kaʻa kaʻa a me ka mea e komo mai ana
Kūkākūkā kamaʻilio: Modbus, Profibus, Ethernet/IP, hoʻohui BACnet
Nānā maikaʻi mana: Voltage, kēia manawa, helu mana, harmonics, ana ikehu
Mālama wānana: Hoʻokaʻaʻike ʻaʻahu ʻaʻahu, helu hana, nānā i ka wela
Kaiapuni noi a me nā hihia hoʻohana
| Māhele ʻOihana | Hoʻohana kikoʻī | Nā kikoʻī maʻamau |
| Na Hale Kalepa | ʻO nā papa hāʻawi nui, nā panelboards, nā ana hoʻolimalima | 125A-800A, thermal-magnetic, plug-in, 25-65kA Icu |
| Nā kikowaena ʻikepili | Ka hāʻawi ʻana i ka UPS, ka pale PDU, ka pahu busbar tap-offs | 250A-1600A, LSIG uila, 100kA+ Icu, hiki ke kamaʻilio |
| Mea Hana Hana | Nā kikowaena hoʻokele kaʻa, nā mea hana mīkini, nā mea hana wili | 63A-630A, nā pale pale kaʻa, ka palena o kēia manawa, 65kA Icu |
| Aila & Gas | ʻO nā rigs drilling, refineries, offshore platforms | 400A-1600A, tropicalized (T2), pale ʻino, 85kA Icu |
| Ikehu Hou | ʻO nā pahu hui pū o ka lā, nā mea hoʻololi makani turbine, ka waiho ʻana i nā pākaukau | 250A-1250A, 1000V DC hiki, hoʻonui i ke ana wela (-25°C a +70°C) |
| ʻOihana | ʻO ka mana traction metro, nā ʻōnaehana ukana mokulele, ka mālama wai | 800A-2000A, hiki ke hoʻihoʻi ʻia, hoʻomanawanui mechanical kiʻekiʻe (10,000+ mau pōʻai) |
| Papahana mālama ola kino | ʻO ka hāʻawi nui ʻana o ka halemai, nā lako kiʻi lāʻau lapaʻau, ka mana pilikia | 400A-1600A, 4-pole me ka pale kūʻokoʻa, ʻelua-kumu hoʻololi hoʻololi |
Ke Kaʻina Hana Hana a me ka Hana Hana Hana
Ka Papa Hana Pono
Mea IQC → Thermosetting Plastic Molding → Contact System Fabrication → Arc Chute Assembly → Mechanism Integration → Trip Unit Installation → Primary Assembly → Calibration & Testing → Final QC → Packaging
Nā ʻanuʻu hana koʻikoʻi
| Ke kahua | Kaʻina hana | Nā Lae Mana Mana |
| Hoʻoheheʻe ʻia ʻo Hoʻoheheʻe ʻia ʻo Thermosetting Plastic Molding | BMC (Bulk Molding Compound) hoʻoheheʻe ʻia ma 150-180°C, 1500-3000 bar pressure, 60-120s manawa hoʻōla | Ka hoʻomanawanui ana ± 0.1mm, hoʻopau i ka ʻili Ra 1.6, helu helu helu >600V, UL 94 V-0 hiki ke wela. |
| Hoʻokaʻaʻike System Fabrication | ʻO nā hui keleawe i uhi ʻia i ke kālā (AgNi 90/10 a i ʻole AgCdO), nā lima hoʻopili i hana ʻia e CNC, e hoʻopaʻa ana i ka lewa nitrogen. | ʻO ka mānoanoa kālā 8-12μm (hōʻoia ʻia ʻo XRF), kūpaʻa pili <100μΩ, paʻakikī HV 100-150 |
| Hana ʻia ʻo Arc Chute | ʻO nā pā hoʻokaʻawale kila (ferromagnetic), nā ʻāpana arc seramika, nā keʻena deionizing, nā geometry arc runner maikaʻi loa. | ʻO ka hōʻoia hoʻopaʻapaʻa mākēneki, ikaika dielectric 2.5kV, ʻano kūlike ± 0.05mm |
| Hui Mechanism Hana | Pūnaehana hoʻouka kila puna, nā mīkini hana wikiwiki/wikiwiki, hoʻolele huakaʻi ʻole, nā pūnāwai mālama ikehu | ʻO ke kūpaʻa paʻa ± 5%, ka hoʻomanawanui mechanical 10,000 pōʻai, ka ikaika huakaʻi 5-15N |
| Hui Hui Kaahele | ʻO ka hoʻopaʻa ʻana i ka bimetal thermal (Inconel/copper), ka wili ʻana o ka coil magnetic, ka hui PCB uila, ka polokalamu firmware. | Ka hōʻoia ʻana o ka pihi manawa, ± 10% ka pololei o kēia manawa, ± 20% ka pololei o ka manawa ma 2×In |
| Hui Hope | ʻO ka hana modular, ka hoʻopaʻa ʻana i ka torque terminal, hoʻopaʻa ʻana i nā uhi hoʻoponopono, hoʻohui pū me nā mīkini | Hoʻopaʻa ʻo Dielectric i 3kV/1min, ke kūpaʻa insulation> 100MΩ, hōʻoia hoʻopili pili. |
Nā Mea Kiʻekiʻe a me nā mea kiko'ī
| ʻāpana | Mea kiko'ī | Nā Kūlana Mea Hoʻolako | Na Waiwai Ki |
| Hale Hoolulu | BMC (Bulk Molding Compound) DMC-2 a i ʻole SMC fiberglass-reinforced polyester | IEC 60664-1, UL 94 V-0 | Helu helu helu>600V, pale wela 180°C, ikaika dielectric>15kV/mm |
| Nā Hoʻopili Nui | ʻO ke keleawe electrolytic (Cu-ETP) C11000 + Ke kala-nickel plating (AgNi 90/10) | ASTM B152, IEC 60368 | Conductivity ≥100% IACS, arc erosion resistance, oxidation stability |
| Nā Hoʻopili Arcing | Kālā-tungsten carbide (AgWC 70/30) a i ʻole Copper-tungsten (CuW 80/20) | ASTM B702 | Kiʻekiʻe arc erosion kū'ē, haʻahaʻa kuʻihao ka manaʻo, pili kū'ē <200μΩ |
| Hoʻokaʻaʻike Puna | Ke keleawe Beryllium (CuBe2 C17200) a i ʻole ke kila kila 301 | ASTM B196, ASTM A240 | Ola luhi >20,000 pōʻaiapuni, paʻa pili pili 8-12N/mm² |
| Nā Papa Māhele Arc | ʻO ke kila SPCC-SD i hoʻoheheʻe ʻia i ke anuanu me ka uhi seramika | JIS G 3141 | ʻO ka hiki ke hoʻokuʻu ʻia > 2000, ke kūpaʻa wela> 1000°C, ka pono hoʻokō arc |
| Punawai hana | ʻO ke kila kalapona ʻaila SWOSC-V a i ʻole 17-7PH kila kila | JIS G 3560 | Ka ikaika tensile 1800-2000MPa, hoʻomaha hoʻomaha <5% ma 20 mau makahiki |
| Nā ʻĀpana Bimetallic | Inconel/copper composite (ASTM TM2) a i ʻole Passivated steel/brass | ASTM B388 | 0.15-0.25mm/°C, paʻa ± 3% ma luna o 20 makahiki |
| Nā Mea Elele | Nā PCB papa hana ʻoihana, nā mea ʻike hopena Hall, nā mea hana ARM Cortex | IEC 60721-3-3, IEC 61000 | Ka mahana hana -25°C a i +70°C, EMC immunity Level 3 |
| Nā ʻōkuhi | T2 keleawe (C11000) me ke tini a i ʻole ka nickel plating | ASTM B187 | ʻO ka nui o kēia manawa 1.2-1.5 A/mm², kū i ka torque 15-50Nm |
Nā Kūlana Kūlana & Nā Kūlana Ho'āʻo
Nā Kūlana Kūlana Kūikawā
| Kūlana | ʻĀpana | Nā helu kūpono |
| IEC 60947-2 | Mea hoʻololi uila haʻahaʻa - Nā mea hoʻopau kaapuni | Ka pae honua no ka hoʻolālā MCCB, hana, hoʻāʻo |
| EN 60947-2 | ʻO ka mana hoʻohālikelike ʻEulopa | ʻO ka hōʻailona CE, ka hoʻokō ʻana o ka mākeke EU |
| GB/T 14048.2 | Kūlike ka pae ʻāina Pākē | CCC palapala hōʻoia, Kina mākeke |
Nā ʻano hoʻāʻo pono (IEC 60947-2)
| Māhele hoʻāʻo | Ho'āʻo kikoʻī | Koina ʻae |
| Hana Dielectric | ʻO ke alapine ikaika ke kū (2kV-3kV/1min) | ʻAʻohe haki, ʻaʻohe flashover, leakage i kēia manawa <2mA |
| Hoʻopaʻa ʻia ka puʻuwai (8kV 1.2/50μs) | ʻAʻohe disruptive discharge | |
| Piʻi wela | Ke kū mau nei ma ka helu In | ʻO nā pahu ≤80K (ka uhi kālā), ≤65K (ke keleawe ʻole), pahu ≤40K |
| Pokole Kaapuni | Hiki i ka haʻihaʻi hope loa (Icu) - 3 hana | Hoʻopau kūleʻa, ʻaʻohe pōʻino mau, hoʻihoʻi dielectric |
| Hiki i ka haʻihaʻi lawelawe (Ics = 50-100% Icu) | 3 mau hana, hoʻomau i ka lawelawe, hoʻopili i ka lole <50% | |
| Pokole-Manawa Manawa | Icw no 0.5s a i ʻole 1s (Māhele B wale nō) | ʻAʻohe deformation, hoʻopili hoʻopili, a i ʻole ka pōʻino insulation |
| Hoomanawanui Mechanical | Nā hana hoʻouka ʻole (maʻamau 8,000-20,000 pōʻaiapuni) | <5% ka hoʻoheheʻe ʻana o nā ʻāpana, ʻaʻohe hemahema mechanical, ke kūpaʻa ʻana o ka torque |
| Hoomanawanui Uila | Hoʻouka i nā hana ma ka helu i kēia manawa (maʻamau 1,000-6,000 pōʻaiapuni) | Hoʻopili i ka lole <50%, mālama ʻia nā ʻano huakaʻi |
| Hōʻoia Hui Kaʻahele | Hoʻokuʻu ʻia ke kaumaha ma 1.05×In (ʻaʻohe huakaʻi), 1.3×In (huakaʻi <2h) | ʻO ka hoʻokō ʻana i ka manawa huakaʻi maʻamau |
| Hoʻokuʻu pōkole ma 5×In, 10×In | Hana koke <0.1s | |
| Ka palena o kēia manawa | Hōʻoia i ka ikehu hoʻokuʻu (I²t). | Ka palena kiʻekiʻe o kēia manawa, hoʻemi ʻana i ka ikehu vs |
Nā Kūlana Kūlana Kūlana o ka Hale Hana
QC mea komo mai (IQC)
| Mea waiwai | Nā mea nānā | Hoʻolālā Laʻana | Mea lako |
| ʻO ka hui ʻilika BMC | ʻO ke aniani fiber content, viscosity, cure features | I kēlā me kēia pūʻulu, hōʻoia COA | Rheometer, mea hoʻoponopono DSC |
| Pili keleawe | Kemika maemae (≥99.9%), conductivity, paakiki | AQL 0.65, ISO 2859 | Spectrometer, mika conductivity |
| Kāwili kala | Mānoanoa 8-12μm (XRF), adhesion (ho'āʻo lipine), porosity | 100% nānā, 5% nānā XRF | X-ray fluorescence, microscope metallurgical |
| Nā ʻāpana bimetallic | Deflection rate, kūpaʻa, kū'ē | I kēlā me kēia pūʻulu, hōʻike hōʻike | ʻO ka umu wela, ke alahaka kū'ē |
| Nā mea kila | ʻO ka paʻakikī HRC 38-45, ka hoʻomanawanui ʻana | AQL 1.0 | ʻO ka mea hōʻike paʻakikī ʻo Rockwell, CMM |
| Nā mea uila | ʻO ka hoʻāʻo hana, hōʻoia parameter, solderability | 100% AOI, 5% hana | LCR mika, oscilloscope, nānā X-ray |
Ka Mana Mana Pono (IPQC)
| Kūlana | Nā ʻāpana hoʻomalu | Ka pinepine | Kaʻina hana |
| Hoʻoheheʻe ʻia | Ka wela 150-180°C, kaomi 1500-3000 bar, manawa ho'ōla | ʻO kēlā me kēia pōʻai | Nānā SCADA, palapala SPC |
| Hui hui | ʻAha pili, kaomi, alignment, mānoanoa kālā | ʻO kēlā me kēia 100 ʻāpana | ʻAi ikaika, mea hoʻohālikelike ʻike, XRF |
| ʻAha hui ʻauʻau | Mākaʻikaʻi pāʻālua, hoʻopololei kaapuni magnetic | ʻO kēlā me kēia 50 ʻāpana | ʻAi hele/ʻaʻole hele, mika ʻano hoʻoheheʻe |
| Mechanism calibration | ʻO ka ikaika o ka pūnāwai, ka hana holo ʻole, ka hana hoʻololi | ʻO kēlā me kēia ʻāpana | Pahu ho'āʻo 'akomi, nā pihi hoʻoneʻe ikaika |
| Hoʻāʻo ʻāpana huakaʻi | ʻO ka hōʻoia ʻana i ka pihi manawa, ka uku ambient | 100% | ʻO ka hoʻāʻo hoʻāʻo hoʻāno mua (500A-10,000A), ka hoʻopaʻa inoa ʻikepili |
Ka Mana Mana Pono (IPQC)
| Mea hoao | Kūlana | Laʻana Laʻana |
| ʻO ka dielectric e kū i ka uila | 2.5kV AC/1min (≤690V helu ʻia) | 100% |
| Kūleʻa hoʻokaʻawale | >100MΩ @ 500V DC | 100% |
| Kū'ē pili | <100μΩ no ka pou ma ka helu In | 100% |
| Nā hiʻohiʻona manawa | ʻO ka manawa kokoke / huakaʻi, hoʻomanawanui mechanical 5 pōʻaiapuni | 100% |
| Hōʻoia kaʻahele huakaʻi | 1.05×In (ʻaʻohe huakaʻi), 1.3×In a i ʻole 2.5×In (huakaʻi) | 100% |
| Nānā hiʻona a me ka nui | ʻO nā kīnā ʻole ma nā ana koʻikoʻi (ka helu IP, mākaʻikaʻi) | 100% |
Hana Hana & Hana Hana
Nā lako hana kiʻekiʻe
| Māhele Lako | ʻIkepili mīkini | Hana | Ka hiki |
| Hoʻoheheʻe Hoʻoheheʻe Thermosetting Injection Molding | 300-toni BMC paʻi paʻi (Buhler/Engel) | MCCB hihia, uhi, arc chute hale hana | 2,000 hihia / lā |
| Kikowaena Mīkini CNC | 5-axis vertical machining center (Mazak/DMG Mori) | ʻO ka mīkini hoʻopili pololei, nā geometries paʻakikī | 8,000 hui hoʻopili / mahina |
| Hoʻopaʻa ʻia a hoʻokumu ʻia | 100-toni holomua paʻi make | Hoʻokumu ʻia ka busbar keleawe, hoʻopili i ka hana puna | 15,000 mau mea / lā |
| Lapaʻau ʻili | Laina pa'i kala 'akomi | Hoʻokaʻaʻike plating mānoanoa mana 8-12μm | 3,000 kg / lā |
| Ahahui | ʻO nā keʻena hui limahana | ʻO ka hui mīkini, nā hana koʻikoʻi kūlike | 1,000 ʻāpana/lā no ka laina |
| Lako Hoao | Hoʻonohonoho ʻia ka hoʻāʻo hoʻāʻo ʻana i ka 10,000A | Hōʻoia huakaʻi kiʻekiʻe o kēia manawa, ka hoʻopaʻa ʻana i ka pihi | 300 ʻāpana / lā |
| Mechanical endurance ho'āʻo pae (20,000 cycles automated) | ʻO ka hoʻāʻo ola, ka nānā ʻana i ka lole | 100 mau ʻāpana i ka manawa like | |
| Keena hoʻāʻo EMC (3m/10m, Teseq/Keysight) | ʻO ka hōʻoia pili ʻana i ka electromagnetic | 50 mau ʻāpana / lā |
Hana Hana & Manawa Manawa
| Māhele Huahana | Hiki i kēlā me kēia mahina | Manawa alakai maʻamau | Hiki ke kauoha koke |
| MCCB paʻakikī (10A-160A) | 50,000 ʻāpana | 4-5 pule | 3 lā (nā ʻāpana waiwai) |
| MCCB waena (160A-630A) | 20,000 ʻāpana | 4-5 pule | 5 lā |
| MCCB Nui (630A-1600A) | 8,000 ʻāpana | 4-5 pule | 7 lā |
| Maxi MCCB (1600A-2000A) | 2,000 ʻāpana | 4-6 pule | 10 lā |
| Nā Hui Kaʻahele uila | 15,000 ʻāpana | 4-5 pule | 3 lā |
ʻEnekinia & ʻenehana Hui Pūʻulu
| Oihana | Paahana | ʻike | Nā kuleana |
| R&D 'enekinia | 5 enekinia | Pūnaehana mana, hoʻolālā electromagnetic, lako polokalamu i hoʻopili ʻia, ʻepekema waiwai | Hoʻomohala huahana hou, hana maʻamau, kōpili patent (50+ mau patent) |
| Kaʻina Hana Hana | 20 ʻenekinia | Thermosetting molding, precision machining, automation, lean manufacturing | Hoʻonui i ka laina hana, palapala SOP, hoʻomaikaʻi i ka hopena (> 98%) |
| Ka ho'āʻo a me ka hōʻoia | 15 enekinia | ʻO ka hoʻāʻo mana kiʻekiʻe, ka simulation kaiapuni, ka ʻenehana hilinaʻi, EMC | ʻAno hoʻonohonoho hoʻāʻo, ka nānā ʻana i ka hemahema, ka hoʻokele hōʻoia (IEC, UL, CCC) |
| Hoʻohana ʻenehana | 12 enekinia | ʻO ka pale ʻana i ka ʻōnaehana mana, ka hoʻonohonoho koho, ka hoʻomaka ʻana o ka kaʻa, ka hoʻokele kahua | Kākoʻo ʻenehana mea kūʻai, hoʻolālā hoʻolālā, hoʻonohonoho pūnaewele |
| Hōʻoia maikaʻi | 25 ʻenehana | ISO 9001, ISO 14001, IATF 16949, kaʻina hana helu helu (SPC) | Hoʻoponopono ka mea hoʻolako, loiloi kaʻina hana, hoʻoponopono hana hoʻoponopono, keʻena metrology |
Nā palapala hōʻoia a me nā palapala hoʻokō
| Palapala hōʻoia | Ke kino hoopuka | ʻĀpana | Pono |
| ISO 9001:2015 | TÜV SÜD / SGS / Bureau Veritas | Pūnaehana hoʻokele maikaʻi | Nānā makahiki |
| IEC 60947-2 ʻAno hoʻāʻo | KEMA/DEKRA, Intertek | Palekana huahana & hana | No ka moʻo huahana |
| CCC (Kina) | CQC (Kina Manaʻo Hōʻoia Koʻikoʻi o Kina) | ʻO ka palapala hōʻoia koi ʻia e Kina | 5-makahiki mana |
| Hoailona CE | Hoʻolaha ʻia ke kino Intertek | Ke komo makeke o EU | Pili i ka hoʻolālā |
No ke aha e kū kaʻawale ai kā mākou hana hana MCCB
Hōʻike kā mākou hale hana40 mau makahiki o ka hana kūikawāi loko o ka hana hoʻoheheʻe kaapuni i hoʻoheheʻe ʻia, e hāʻawi ana i nā huahana i ʻoi aku ma mua o nā kūlana honua ma o:
Hoʻohui kū pololei: ʻO ka hui pū ʻana o ka BMC i loko o ka hale, ka hoʻopili pololei ʻana i ka plating, a me ka hana ʻana o nā ʻāpana huakaʻi uila e hōʻoia i ka mana piha o ka maikaʻi a me ka loiloi kumu kūʻai.
ʻenehana hoʻoheheʻe kiʻekiʻe: 300-toni thermosetting injection presses me ka automated material handling a real-time process monitoring (SCADA integration)
Hoʻāʻo i nā ʻōnaehana: $3M+ i hoʻokomo ʻia i loko o nā hale hana mana kiʻekiʻe e hiki ai ke hōʻoia i ka 200kA pōkole pōkole a me ka hoʻohālikelike kaiapuni piha.
Hoʻolālā hōʻoia honua: ʻO ka hoʻokō maʻamau e hiki ai ke komo i ka mākeke ma waena o 100+ mau ʻāina me ka ʻole o ka hoʻāʻo ʻana.
Ka hiki ke hoʻopilikino: Mai nā ʻāpana tropical kūikawā i nā protocol kamaʻilio proprietary a me nā hoʻonohonoho hoʻonohonoho kūʻokoʻa, ʻenehana mākou i kāu kikoʻī.
No nā kikoʻī kikoʻī, nā haʻawina hoʻonohonoho koho, nā pihi pale kaʻa, a i ʻole ka hoʻonohonoho ʻana o ka hale hana, hāʻawi kā mākou hui ʻenekinia i ke kūkākūkā pololei e hōʻoia i ka hoʻokō ʻana o kāu hana hoʻolaha mana i nā koi palekana a me nā pahuhopu hoʻomau hana.
- View as
ʻAno Paʻa i hoʻoheheʻe ʻia ka hihia kaapuni
Kumu kiʻekiʻe kiʻekiʻe a holomua Paʻa Type Molded Case Circuit Breaker (MCCB) mai Shanghai DADA Electric—hōʻoia (CE, CB, ASTA), pale thermal-magnetic, 12.5A–1600A. Kūpono no nā paneli ʻoihana a me nā ʻoihana. DIN-rail maʻalahi a i ʻole ka mauna panel. Hoʻokipa ʻia nā kauoha OEM & nui, koho iā CDADA i mea hoʻolako me ka hilinaʻi.
CM1 Kaapuni kaapuni i hoopololeiia
Hoʻokumu ʻia kēia CDADA CM1 Molded Case Circuit Breaker (MCCB) no ke kūʻai nui ʻana, me ka hōʻoia IEC60947-2 a me ka hana paʻa no nā ʻōnaehana mana ʻoihana. Ke hoʻohana nei ka CM1 MCCB i ka hoʻolālā ikaika kiʻekiʻe a me ka mīkini tripping hilinaʻi, maʻalahi e hoʻouka a mālama. Hoʻohui ia i ka pale naʻauao me ka hoʻolālā lōʻihi, e hōʻoiaʻiʻo ana i ke ola lawelawe lōʻihi i ka hāʻawi mana a me nā noi ʻoihana kaumaha.
160A MCCB hiki ke hoʻololi ʻia ka Thermal Magnetic
ʻO CDADA ka mea hana o 160A Thermal magnetic adjustable MCCB, maikaʻi kā mākou huahana no ka kūʻai nui ʻana, kahi mea hoʻoheheʻe kiʻekiʻe i hoʻoheheʻe ʻia i hōʻoia ʻia me IEC60947-2 no ka hāʻawi ʻana i ka mana ʻoihana. Ke hoʻohana nei kēia MCCB i ka hoʻolālā palena o kēia manawa a me nā mea modular, maʻalahi e hoʻouka a mālama. Hoʻohui ia i ka tripping hiki ke hoʻololi ʻia me ka hoʻolālā hoʻopili patented, loaʻa ke ola lōʻihi a me ka pale kaapuni paʻa.
125A mea hiki ke hoʻopololei ʻia ka hihia kaapuni
ʻO 125A Adjustable Molded Case Circuit Breaker kekahi o nā huahana a CDADA, ma ke ʻano he hale hana ʻoihana, hana kiʻekiʻe kā mākou huahana me ka palapala hōʻoia IEC60947-2 no ka hāʻawi ʻana i ka mana hilinaʻi. Hōʻike ia i ka hoʻolālā palena o kēia manawa a me nā mea modular, maʻalahi e hoʻouka a mālama. Hoʻohui ia i ka tripping hiki ke hoʻololi ʻia me ka hoʻopili hoʻopili patented, loaʻa ke ola lōʻihi a me ka pale paʻa no nā kaapuni ʻoihana.
ʻO MCCB hiki ke hoʻoponopono ʻia
ʻO ke kumu kiʻekiʻe Thermal Magnetic Adjustable MCCB mai Shanghai DADA Electric, kahi mea hana loea me 40+ mau makahiki o ka ʻike. Hoʻopaʻa ʻia kā mākou huahana (CE, CB, ASTA), me nā hoʻonohonoho thermal adjustable (70-100% In) & magnetic (5-10×In). Kūpono no ka pale pololei ʻana i nā paneli ʻoihana. 250A a hiki i 1600A, 3P/4P, paʻa a pili i ka honua.
Mea hoʻoheheʻe kaapuni wela i hiki ke hoʻoponopono ʻia
E ʻike i ka CDADA DAM1 Series Thermal Adjustable Molded Case Circuit Breaker mai 贴ka hale hana hilinaʻi, Shanghai DADA Electric—hōʻoia (ASTA, KEMA, CE) a me nā hoʻonohonoho wela hiki ke hoʻololi ʻia (70-100% In). He kūpono no ka pale overload pololei i nā noi ʻoihana. Loaʻa i nā hoʻonohonoho 3P/4P a hiki i 1600A ma 400V/415V. Kūpono no nā OEM a me nā mea kūʻai nui.
He Hoʻoheheʻe Kaapuni Kaapuni mea hana a mea hoʻolako ʻo CDADA ma Kina. Hāʻawi kā mākou hale hana i nā ʻoihana like ʻole e like me nā ʻōnaehana mana, kūkulu ʻana i ka automation, a me ka hana ʻenehana, e hāʻawi ana i nā hoʻonā OEM/ODM maʻalahi.
